METHODS AND APPARATUS FOR DETERMINING A SHIM PROFILE FOR ASSEMBLING A FIRST PART WITH A SECOND PART

A method for determining a shim profile (250) for assembling a first mating surface (215) of a first part (210) with a second mating surface (225) of a second part (220) includes: obtaining a baseline surface model (300) of the first mating surface (215); scanning the first mating surface (215) when...

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Bibliographische Detailangaben
Hauptverfasser:	CHENG, Steve X, BOYL-DAVIS, Theodore M, ADRIANCE, Joel T, COLLINS, Ronald J, BOROWICZ, Clifford D, RHOADS, Christopher M, RABIEGA, Marcin A
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AIRCRAFT AVIATION CALCULATING COMPUTING COSMONAUTICS COUNTING DESIGNING, MANUFACTURING, ASSEMBLING, CLEANING, MAINTAINING ORREPAIRING AIRCRAFT, NOT OTHERWISE PROVIDED FOR ELECTRIC DIGITAL DATA PROCESSING GROUND OR AIRCRAFT-CARRIER-DECK INSTALLATIONS SPECIALLYADAPTED FOR USE IN CONNECTION WITH AIRCRAFT HANDLING, TRANSPORTING, TESTING OR INSPECTING AIRCRAFTCOMPONENTS, NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS TRANSPORTING
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Beschreibung
Zusammenfassung:	A method for determining a shim profile (250) for assembling a first mating surface (215) of a first part (210) with a second mating surface (225) of a second part (220) includes: obtaining a baseline surface model (300) of the first mating surface (215); scanning the first mating surface (215) when the first part is in a deviated configuration to generate a scan-based surface model (310) of the first mating surface (215); deforming the scan-based surface model (310) of the first mating surface (215) relative to the baseline surface model (300) of the first mating surface to generate a first deformed surface model (320) of the first mating surface; deforming the first deformed surface model (320) of the first mating surface (215) relative to a surface model (330) of the second mating surface (225) to generate a second deformed surface model (370) of the first mating surface (215); and comparing the second deformed surface model (370) of the first mating surface (215) to the surface model (330) of the second mating surface (225).