ACTIVATING RINSE AND METHOD FOR TREATING A SUBSTRATE

Disclosed is an activating rinse for treating at least a portion of a substrate, comprising a dispersion of metal phosphate particles having a D90 particle size of no greater than 10 µm, wherein the metal phosphate comprises divalent or trivalent metals or combinations thereof; a dispersant; and a m...

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Bibliographische Detailangaben
Hauptverfasser:	Wehrle, Matthew E, Lemon, Steven J, Silvernail, Nathan J, Votruba-Drzal, Peter, McMillen, Mark W, Karabin, Richard F
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Disclosed is an activating rinse for treating at least a portion of a substrate, comprising a dispersion of metal phosphate particles having a D90 particle size of no greater than 10 µm, wherein the metal phosphate comprises divalent or trivalent metals or combinations thereof; a dispersant; and a metal sulfate salt. Methods of treating a substrate with the activating rinse also are disclosed. Optionally, substrates treated with the activating rinse also are disclosed.