MULTIFUNCTIONAL PRESSURE PADS FOR INDUCTION WELDING

A compression load distributor includes a support layer (304, 404) and a heat spreading layer (301, 401). The support layer (304, 404) includes a flexible carrier (305, 405) configured to distribute a load from a compression load applying device. The heat spreading layer (301, 401) is coupled to and...

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Bibliographische Detailangaben
Hauptverfasser:	BUSER, Yannick, SAMALOT, Francis J, MARTÍN ALONSO, Pedro Pablo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A compression load distributor includes a support layer (304, 404) and a heat spreading layer (301, 401). The support layer (304, 404) includes a flexible carrier (305, 405) configured to distribute a load from a compression load applying device. The heat spreading layer (301, 401) is coupled to and carried on the support layer (304, 404), the heat spreading layer (301, 401) comprising a heat sink (302, 402) configured to transfer heat throughout the compression load distributor. The heat sink (302, 402) is thermally conductive and electrically non-conductive.