HEAT PUMP DEVICE

A heat pump device having a refrigerant circuit includes: a valve (1017, 1018) configured to maintain an opening degree during non-energization; a valve drive circuit (1322) configured to cause operation of the valve (1017, 1018); a valve control unit (1324) configured to control the valve drive cir...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OHTANI, Atsushi, FUJIMOTO, Yuusuke, TAOKA, Kentaroh, CORNELIS, Kevin, TOYOTA, Ryuuichi, STEEN, David
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BLASTING COMBINED HEATING AND REFRIGERATION SYSTEMS HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING WEAPONS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A heat pump device having a refrigerant circuit includes: a valve (1017, 1018) configured to maintain an opening degree during non-energization; a valve drive circuit (1322) configured to cause operation of the valve (1017, 1018); a valve control unit (1324) configured to control the valve drive circuit (1322); and a power source circuit (PW) configured to supply a power source to the valve drive circuit (1322). The power source circuit (PW) includes: a first power source circuit unit (P1) configured to receive power source supply from the outside to generate a DC voltage; and a second power source circuit unit (P2) for backup. The second power source circuit unit (P2) receives power source supply from the outside to store power in a capacitor, and connects the capacitor in parallel to a first output electric path (L1) of the first power source circuit unit (P1).