LASER CUTTING METHOD AND ASSOCIATED LASER CUTTING DEVICE

A laser cutting method cuts a planar material using an associated laser cutting device. In a first step the material to be cut is weakened along a provided cutting line by irradiation by a pulsed first laser beam. In a second step, the material to be cut is locally heated by irradiation by a second...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	POLUSHKIN, Sergey, AMLER, Hans
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A laser cutting method cuts a planar material using an associated laser cutting device. In a first step the material to be cut is weakened along a provided cutting line by irradiation by a pulsed first laser beam. In a second step, the material to be cut is locally heated by irradiation by a second laser beam in the region of the cutting line in order to produce material stress. In the second step, the material to be cut is heated only in one place or in a plurality of spaced apart places on the cutting line.