AN INTEGRATED COOLING LIQUID CAVITY IN A PRINTED CIRCUIT BOARD AND A METHOD TO MAKE THE SAME

The present invention concerns a method and a device for making an integrated cooling liquid cavity in a printed circuit board by:- inserting a power semiconductor die in a dielectric material,- laminating the dielectric material with a dielectric material and a thin electrically conducting layer on...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MOLLOV, Stefan, MORAND, Julien
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention concerns a method and a device for making an integrated cooling liquid cavity in a printed circuit board by:- inserting a power semiconductor die in a dielectric material,- laminating the dielectric material with a dielectric material and a thin electrically conducting layer on each side of the dielectric material,- drilling vias through the laminated copper and dielectric layers,- metallizing the vias in order to form a first printed circuit board,- laminating a dielectric material, a soluble material having a predetermined form and an electrically conducting layer on the first printed circuit board,- injecting solvent in the soluble material in order to dissolve the soluble material and reveal a cavity,- injecting cooling liquid in the revealed cavity.