ENCAPSULATING MATERIAL FOR COMPRESSION MOLDING AND ELECTRONIC PART AND DEVICE

This encapsulating material for compression molding contains an epoxy resin, a curing agent, and an inorganic filler, wherein, in the image that is obtained when this encapsulating material for compression molding is compression-molded on a substrate via a silicon chip and the resultant compression-...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OKUBO, Seigo, KANG, Dongchul
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	This encapsulating material for compression molding contains an epoxy resin, a curing agent, and an inorganic filler, wherein, in the image that is obtained when this encapsulating material for compression molding is compression-molded on a substrate via a silicon chip and the resultant compression-molded body is observed using an ultrasonic flaw detector, it is found that the surface area of the portion other than dark spots of the region corresponding to the compression-molded body on the chip is at least 86% of the surface area of the entire region corresponding to the compression-molded body on the chip.