MEMBER FOR SEMICONDUCTOR CLEANING APPARATUS

Provided are members for semiconductor cleaning apparatuses, the members being resistant to thermal deformation and less likely to cause metal release. The disclosure relates to a member for a semiconductor cleaning apparatus, including prepreg containing a carbon fiber and a tetrafluoroethylene/per...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HAGI, Keisuke, YUKAWA, Hirokazu, MURAKAMI, Shinji, MASUI, Toshiaki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided are members for semiconductor cleaning apparatuses, the members being resistant to thermal deformation and less likely to cause metal release. The disclosure relates to a member for a semiconductor cleaning apparatus, including prepreg containing a carbon fiber and a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer which are thermally fused with each other.