METAL-CLAD LAMINATE FOR FLEXIBLE ELECTRONIC DEVICES, AND FLEXIBLE ELECTRONIC DEVICE USING SAME

METAL-CLAD LAMINATE FOR FLEXIBLE ELECTRONIC DEVICES, AND FLEXIBLE ELECTRONIC DEVICE USING SAME

A metal-clad laminate for flexible electronic devices, said metal-clad laminate comprising a metal layer and a polyimide insulating layer that is superposed on one surface of the metal layer and contains one or more polyimide layers, wherein the polyimide insulating layer satisfies the following req...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NAKATSUKA, Jun, HIRAISHI, Katsufumi, WANG, Hongyuan, KAWAI, Shouhei, IWASAKI, Toshio
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A metal-clad laminate for flexible electronic devices, said metal-clad laminate comprising a metal layer and a polyimide insulating layer that is superposed on one surface of the metal layer and contains one or more polyimide layers, wherein the polyimide insulating layer satisfies the following requirements: (a) the thickness thereof is within the range of from 3 µm to 25 µm; (b) the thickness ratio thereof to the metal layer is within the range of from 0.1 to 0.5; (c) the thermal expansion coefficient thereof is 25 ppm/K or less; (d) the coefficient of humidity expansion thereof is 30 ppm/% RH or less; (e) the arithmetic mean roughness (Ra) of the exposed surface, which is not in contact with the metal layer, is 1.0 nm or less; and (f) the polyimide that constitutes the polyimide layer having the exposed surface, which is not in contact with the metal layer, is not thermoplastic.