SOLID-STATE COOLING MODULE

A solid-state cooling module (20) includes a plurality of housing portions (22) each housing a solid refrigerant substance (23) and is configured to heat or cool a heat medium flowing through insides of the plurality of housing portions (22). At least some of the plurality of housing portions (22) a...

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Bibliographische Detailangaben
1. Verfasser: TERAKI, Junichi
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A solid-state cooling module (20) includes a plurality of housing portions (22) each housing a solid refrigerant substance (23) and is configured to heat or cool a heat medium flowing through insides of the plurality of housing portions (22). At least some of the plurality of housing portions (22) are connected to each other in series with respect to a flow of the heat medium.