RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAMINATED PLATE, AND PRINTED WIRING BOARD

A resin composition contains an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a phosphorus-containing epoxy resin. The curing agent includes dicyandiamide. The inorganic filler includes: a silica-treated magnesium hydroxide that is a magnesium hydroxide subjected to...

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Bibliographische Detailangaben
Hauptverfasser:	NAKASHIMA, Takayuki, ENDOU, Kazuei, HANAZAKI, Shohei, IRIFUNE, Akira, SAGARA, Takashi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A resin composition contains an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a phosphorus-containing epoxy resin. The curing agent includes dicyandiamide. The inorganic filler includes: a silica-treated magnesium hydroxide that is a magnesium hydroxide subjected to surface treatment with silica; and aluminum hydroxide. Total content of the silica-treated magnesium hydroxide and the aluminum hydroxide falls within a range from 30 parts by mass to 80 parts by mass with respect to 100 parts by mass in total of the epoxy resin and the curing agent.