EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, CURABLE RESIN COMPOSITION CONTAINING EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, AND CURED PRODUCT OF SAME

Provided is a polyorganosiloxane with an epoxy group, a curable resin composition, and a cured product with high compatibility with an initiator and another resin, low viscosity, a high curing rate, and high adhesiveness and impact resistance. A polyorganosiloxane with an epoxy group comprising an M...

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Bibliographische Detailangaben
Hauptverfasser:	WATANABE, Takumi, OGASAWARA, Hayato, HIRASE, Shohei, YODA, Shoya, HARUTA, Yuki, TERADA, Noriaki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a polyorganosiloxane with an epoxy group, a curable resin composition, and a cured product with high compatibility with an initiator and another resin, low viscosity, a high curing rate, and high adhesiveness and impact resistance. A polyorganosiloxane with an epoxy group comprising an M unit (R1R2R3SiO1/2), a D unit (R4R5O2/2), and a Q unit (SiO4/2), a T unit (R6SiO3/2) content being 80% or less by mole of total silicon. The epoxy group has a group represented by the following formula (2) and a group represented by the following formula (3). In the formula (2), R8 denotes an optionally substituted divalent organic group having 1 to 20 carbon atoms. g is 0 or 1. In the formula (3), R9 denotes an optionally substituted divalent organic group having 1 to 20 carbon atoms. h is 0 or 1, 0 ≤ i ≤ 8, and 0 < j ≤ 8.