COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY

A copper paste for joining contains copper particles, a polycarboxylic acid having a melting point of 120°C or lower, and a dispersion medium. A method for manufacturing a joined body includes a first step of preparing a laminate in which a first member, a copper paste for joining, and a second memb...

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Bibliographische Detailangaben
Hauptverfasser:	SUGAMA, Chie, NATORI, Michiko, EJIRI, Yoshinori, NAKAKO, Hideo, KAWANA, Yuki, ISHIKAWA, Dai, NEGISHI, Motohiro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING CHEMISTRY CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	A copper paste for joining contains copper particles, a polycarboxylic acid having a melting point of 120°C or lower, and a dispersion medium. A method for manufacturing a joined body includes a first step of preparing a laminate in which a first member, a copper paste for joining, and a second member are laminated in this order, and a second step of heating the laminate under a gas atmosphere having a hydrogen concentration of 45% or less to sinter the copper paste for joining. Ajoined body includes a first member, a second member, and a sintered body of a copper paste for joining that joins the first member and the second member.