THERMAL OPTIMIZATIONS FOR OSFP OPTICAL TRANSCEIVER MODULES

A system is disclosed comprising an Octal Small Formfactor Pluggable (OSFP) module (370), the module comprising a front side and a back side opposite the front side, a substantially continuous top surface extending from a portion of the front side to a portion of the back side, a data connector (372...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BEAUIN, Melanie, SHEN, Zuowei, LAU, Michael Chi Kin, CENTOLA, Federico Pio, LEE, Justin Sishung, IYENGAR, Madhusudan K, EDWARDS, William F. Jr, LEE, Timothy Conrad
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS TRANSMISSION
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Beschreibung
Zusammenfassung:	A system is disclosed comprising an Octal Small Formfactor Pluggable (OSFP) module (370), the module comprising a front side and a back side opposite the front side, a substantially continuous top surface extending from a portion of the front side to a portion of the back side, a data connector (372) formed on the front side, an air duct (377) with a first end and a second end, the first end of the air duct forming a closed connection with the back side of the module, a blower (374), with a first end and an exhaust, the first end of the blower forming a closed connection with the second end of the air duc, and an airpath (375) formed from the front side of the module to the exhaust end of the blower through at least the air duct.