POWER DEVICE PACKAGING
A semiconductor device package comprising a multilayer substrate including a top layer (60), a bottom layer (70) and an intermediate layer (40) between the top layer and the bottom layer, and one or more semiconductor dies (30) embedded in the intermediate layer, and further comprising conductive co...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | A semiconductor device package comprising a multilayer substrate including a top layer (60), a bottom layer (70) and an intermediate layer (40) between the top layer and the bottom layer, and one or more semiconductor dies (30) embedded in the intermediate layer, and further comprising conductive connector means to provide a conductive connection from the one or more dies, the conductive connector means extending through the top layer to provide connection means for one or more devices mounted on or adjacent the top layer. |
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