METHOD FOR DETACHING ADHESIVELY BONDED SUBSTRATES

The present invention is directed to a method for detaching two substrates bonded by an adhesive, in particular by treating with a debonding agent. In addition, the present invention relates to the use of the method in recycling parts of the electronic devices. The method comprises the steps of: (1)...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Ferencz, Andreas, Burns, Barry, Franken, Uwe
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention is directed to a method for detaching two substrates bonded by an adhesive, in particular by treating with a debonding agent. In addition, the present invention relates to the use of the method in recycling parts of the electronic devices. The method comprises the steps of: (1) treating two substrates bonded by an adhesive with a debonding agent comprising acetone and/or oleic acid at a temperature from 20°C to 90°C, and (2) removing the substrates from the adhesive.