GOLD POWDER, METHOD FOR MANUFACTURING GOLD POWDER, AND GOLD PASTE

The present invention relates to a gold powder comprising gold having a purity of 99.9% by mass or more and having an average particle size of 0.01 µm or more and 1.0 µm or less. In this gold powder, a content of a chloride ion is 100 ppm or less, and a content of a cyanide ion is 10 ppm or more and...

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Bibliographische Detailangaben
Hauptverfasser:	MIYAIRI Masayuki, OGASHIWA Toshinori
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASTING CONDUCTORS ELECTRICITY INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER PERFORMING OPERATIONS POWDER METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	The present invention relates to a gold powder comprising gold having a purity of 99.9% by mass or more and having an average particle size of 0.01 µm or more and 1.0 µm or less. In this gold powder, a content of a chloride ion is 100 ppm or less, and a content of a cyanide ion is 10 ppm or more and 1000 ppm or less. A total of the content of a chloride ion and the content of a cyanide ion is preferably 110 ppm or more and 1000 ppm or less. The gold powder of the present invention is excellent in adaptability to various processes including bonding or the like with a content of a chloride ion, that is, an impurity, optimized. A gold paste using this gold powder is suitably used in various uses for bonding such as die bonding of a semiconductor chip, sealing a semiconductor package, and forming an electrode/wire.