A MODIFIED EPOXY RESIN

The present disclosure relates to a modified epoxy resin having the formula (I):whereinR is R1, R2 or a combination of R1 and R2;R1 and R2 are independently alkylene group having 1 to 32 C atoms, branched alkylene group having 1 to 32 C atoms, cyclo-aliphatic group, substituted cycloaliphatic group,...

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Bibliographische Detailangaben
Hauptverfasser:	KHULLAR, Alok, ONTHAWORN, Jidapha, TIMNGIM, Mallika, KUNWONG, Dapawan, SUCKLEY, Daniel, NOGHAN, Suphansa, DUBEY, Pradip Kumar, NAIYAWAT, Thipa
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present disclosure relates to a modified epoxy resin having the formula (I):whereinR is R1, R2 or a combination of R1 and R2;R1 and R2 are independently alkylene group having 1 to 32 C atoms, branched alkylene group having 1 to 32 C atoms, cyclo-aliphatic group, substituted cycloaliphatic group, aromatic group, substituted aromatic group, biarylene or alkyl substituted biaryl group, cycloaliphatic-aromatic group or arylene-Z-arylene group;X and Y are independently O, -C(O)O-, or an amine group;Z is dicyclopentadiene;R3 and R4 are independently either H, alkyl group, branched alkyl group, alkoxy group, or substituted biaryl group; R4 and R3 optionally forming a fused aromatic ring or a fused hetero aromatic ring;n is 0 to 1 wherein concentration of n=0 monomer is greater than 75%; andN is 1-20.