SUBSTRATE WORK MACHINE AND METHOD FOR CONTROLLING SUBSTRATE WORK MACHINE

A board work machine includes a board holding portion configured to hold a board, a work head configured to hold a lead component having a lead wire and insert the lead wire into a through-hole formed in the board, a lead wire cutting device configured to cut the lead wire inserted into the board by...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TORII, Hisahiro, NAGAISHI, Takuya
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A board work machine includes a board holding portion configured to hold a board, a work head configured to hold a lead component having a lead wire and insert the lead wire into a through-hole formed in the board, a lead wire cutting device configured to cut the lead wire inserted into the board by relatively reciprocally moving a first blade portion and a second blade portion, a distortion sensor configured to detect distortion of at least one of the first blade portion or the second blade portion, and a control device configured to drive the lead wire cutting device to acquire a value from the distortion sensor when the lead wire is not inserted into the board.