METHOD OF MANUFACTURING AN INTERPOSER PRODUCT
A method of manufacturing an interposer product (10) comprises the formation, on the same side of an interposer substrate (2), of at least one wire-bonding pad (12) and at least one bonding bump (14). The method comprises the formation on the substrate (2), by a common process, of first and second p...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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