METHOD OF MANUFACTURING AN INTERPOSER PRODUCT
A method of manufacturing an interposer product (10) comprises the formation, on the same side of an interposer substrate (2), of at least one wire-bonding pad (12) and at least one bonding bump (14). The method comprises the formation on the substrate (2), by a common process, of first and second p...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | A method of manufacturing an interposer product (10) comprises the formation, on the same side of an interposer substrate (2), of at least one wire-bonding pad (12) and at least one bonding bump (14). The method comprises the formation on the substrate (2), by a common process, of first and second portions (6a,6b) of a gold layer. The first portion (6a) of the gold layer constitutes the wire-bonding pad. Then a layer (7) of solder paste comprising gold-tin alloy having a first composition, with less gold than the eutectic composition, is deposited on the second portion (6b) of the gold layer. A reflow process merges the deposited layer (7) of gold-tin solder with the underlying portion of the gold layer, to form a bonding bump (8/14). The bonding bump is planarized to a target thickness. The majority of the bonding bump (8) is made of gold-tin alloy having the eutectic composition. |
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