METHOD FOR DIVIDING COMPOSITE MATERIAL

To provide a method that is capable of dividing a composite material in which a brittle material layer and a resin layer are laminated, without generating a crack in an end face of the brittle material layer.This invention is a method for dividing a composite material 10 in which a brittle material...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUO, Naoyuki, KANNO, Toshihiro, SHINOZAKI, Takahiro, NAKAI, Kota
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	To provide a method that is capable of dividing a composite material in which a brittle material layer and a resin layer are laminated, without generating a crack in an end face of the brittle material layer.This invention is a method for dividing a composite material 10 in which a brittle material layer 1 and a resin layer 2 are laminated, including: a resin removing step of irradiating the resin layer with a laser beam L1 oscillated from a CO2 laser source 20 along scheduled dividing lines DL of the composite material to form a processing groove 25 along the scheduled dividing lines; and after the resin removing step, a brittle material removing step of irradiating the brittle material layer with a laser beam L2 oscillated from an ultrashort pulsed laser source 30 along the scheduled dividing lines to form a processing mark 11 along the scheduled dividing lines. In the resin removing step, in a region IS where the scheduled dividing lines intersect, the laser beam oscillated from the CO2 laser source is not irradiated multiple times, or an irradiation amount of the laser beam is decreased relative to an irradiation amount in a region other than a region where the scheduled dividing lines intersect.