METHODS AND APPARATUS FOR POST EXPOSURE PROCESSING

Embodiments described herein relate to methods and apparatus for post exposure processing. More specifically, embodiments described herein relate to field-guided post exposure bake (iFGPEB) chambers and processes, In one embodiment, a substrate is transferred into a post exposure process chamber and...

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Hauptverfasser: LIANG, Qiwei, PISHARODY, Gautam, HUANG, Lancelot, TSO, Alan
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Sprache:eng ; fre ; ger
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creator LIANG, Qiwei
PISHARODY, Gautam
HUANG, Lancelot
TSO, Alan
description Embodiments described herein relate to methods and apparatus for post exposure processing. More specifically, embodiments described herein relate to field-guided post exposure bake (iFGPEB) chambers and processes, In one embodiment, a substrate is transferred into a post exposure process chamber and then raised to a pre-processing position by a plurality of lift pins. A substrate support is then raised to engage with the substrate and vacuum chuck the substrate thereon prior to iFGPEB processing.
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language eng ; fre ; ger
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subjects APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
title METHODS AND APPARATUS FOR POST EXPOSURE PROCESSING
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