METHODS AND APPARATUS FOR POST EXPOSURE PROCESSING

Embodiments described herein relate to methods and apparatus for post exposure processing. More specifically, embodiments described herein relate to field-guided post exposure bake (iFGPEB) chambers and processes, In one embodiment, a substrate is transferred into a post exposure process chamber and...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LIANG, Qiwei, PISHARODY, Gautam, HUANG, Lancelot, TSO, Alan
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Embodiments described herein relate to methods and apparatus for post exposure processing. More specifically, embodiments described herein relate to field-guided post exposure bake (iFGPEB) chambers and processes, In one embodiment, a substrate is transferred into a post exposure process chamber and then raised to a pre-processing position by a plurality of lift pins. A substrate support is then raised to engage with the substrate and vacuum chuck the substrate thereon prior to iFGPEB processing.