METHOD FOR REPAIRING A CIRCUIT BOARD WITH USE OF A PEN FOR TRANSFERRING SOLDER PASTE FROM A RESERVOIR ONTO A CONTACT POINT OF THE CIRCUIT BOARD

The invention relates to a pen (2) for transferring solder paste from a reservoir onto a contact point of a circuit board, wherein the pen (2) comprises: a rod-shaped element (210) with an axis of rotation (RA) in the longitudinal direction; a solder application pad (220), which consists of a main body (221) with an end face and a pin projecting (222) from the end face, wherein the solder application pad (220) has a longitudinal axis (LAI) and is mounted on an end region of the rod-shaped element (210) in such a way that the longitudinal axis (LAI) of the main body (221) lies on an extension of the axis of rotation (RA) of the rod-shaped (210) element, wherein the pin (222) has a longitudinal axis (LA2) and is disposed in such a manner that the longitudinal axis (LA2) of the pin (222) lies on an extension of the axis of rotation (RA) of the rod-shaped element (210), wherein the end face is designed with rotational symmetry to the longitudinal axis (LA2) of the pin (222), and wherein the pin (222) has a projection area on a first end region and wherein the projection area is smaller than the end face; wherein the pin (222) is designed to be substantially cylindrical and the end face is designed such that the angle (a) between the longitudinal axis (LA2) of the pin (222) and the end face is less than 180°, preferably between 60° and 120°, particularly preferably substantially 90°. The invention also relates to a method for producing the pen (2) according to the invention and to the use of the pen (2) in a method for repairing a circuit board with at least one defective component.