MULTILAYER FILM AND PACKAGE

Provided is a multilayer film, in which in a case where a molding test for forming, by thermal molding, solid accommodation part having a recessed shape that opens on one surface of the multilayer film and protrudes on the other surface is carried out multiple times with respect to the multilayer fi...

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Bibliographische Detailangaben
1. Verfasser: OKU Shintaro
Format: Patent
Sprache:eng ; fre ; ger
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