MULTILAYER FILM AND PACKAGE

Provided is a multilayer film, in which in a case where a molding test for forming, by thermal molding, solid accommodation part having a recessed shape that opens on one surface of the multilayer film and protrudes on the other surface is carried out multiple times with respect to the multilayer film under a uniform molding pressure and at various molding temperatures, a difference between the molding temperatures that differ from each other is 10°C or higher, in which the molding temperatures enables a ratio of a depth to an inner diameter of the solid accommodation part to be 0.37 to 0.43, and enables the multilayer film of the solid accommodation part to have a thickness of 20% to 100% with respect to a thickness before the thermal molding, and a difference between a maximum temperature value and a minimum temperature value of the multilayer film in a case where a storage elastic modulus of the multilayer film is 5.0 × 106 to 5.0 × 107 Pa is 25°C to 140°C.