ANTENNA MANUFACTURING METHOD AND ANTENNA DEVICE

A conductor ground plane (2) provided on a dielectric substrate (1) and provided with a patch antenna (11) and a conductor ground plane (4) provided on the side of a dielectric substrate (5) having a through hole (5a) are bonded by solder (3) in a state where the through hole (5a) and the patch ante...

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Bibliographische Detailangaben
Hauptverfasser:	IWAKI, Kensuke, YOKOKAWA, Kei, FUKASAWA, Toru, FUJIWARA, Keisuke, KONO, Takamichi, ARAI, Hitoshi, NAKAMOTO, Narihiro, TAKAHASHI, Tomohiro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A conductor ground plane (2) provided on a dielectric substrate (1) and provided with a patch antenna (11) and a conductor ground plane (4) provided on the side of a dielectric substrate (5) having a through hole (5a) are bonded by solder (3) in a state where the through hole (5a) and the patch antenna (11) are arranged to face each other, and a conductor ground plane (6) provided on the back side of the dielectric substrate (5) and a conductor ground plane (8) provided on a dielectric substrate (9) are bonded by solder (7).