METHOD FOR BORING OR CUTTING BY REMOVING MELTABLE OR VAPOURISABLE MATERIAL OF A WORKPIECE

The invention relates to a method for boring or cutting by removing meltable or vapourisable material of a workpiece (2) by means of laser radiation absorption, melted and/or vapourised material being transported away out of the forming bore hole (1), the forming cutting kerf or the forming cutting...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PETRING, Dirk, ARNTZ-SCHROEDER, Dennis
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention relates to a method for boring or cutting by removing meltable or vapourisable material of a workpiece (2) by means of laser radiation absorption, melted and/or vapourised material being transported away out of the forming bore hole (1), the forming cutting kerf or the forming cutting slit (1), defined as the removal zone, by a gas flow (6). One or more method parameters are modulated by the fundamental natural frequency of the gas volume spatially delimited by a forming wall in the region of the removal zone, by higher harmonics thereof or by a mixture thereof, in order to thereby support the transportation of the material out of the forming removal zone.