IMAGING ELEMENT AND IMAGING DEVICE

Leakage of incident light to a charge holding part is reduced in a back surface irradiation type imaging element.The imaging element includes a photoelectric conversion part, a reflection part, and a reflection part formation member. The photoelectric conversion part is formed in a semiconductor sub...

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Hauptverfasser: MASAGAKI Atsushi, KUNITAKE Sachihito, NOUDO Shinichiro
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Sprache:eng ; fre ; ger
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creator MASAGAKI Atsushi
KUNITAKE Sachihito
NOUDO Shinichiro
description Leakage of incident light to a charge holding part is reduced in a back surface irradiation type imaging element.The imaging element includes a photoelectric conversion part, a reflection part, and a reflection part formation member. The photoelectric conversion part is formed in a semiconductor substrate and performs photoelectric conversion of incident light. The reflection part is disposed in a front surface of the semiconductor substrate, which is different from a surface on which the incident light is incident, to reflect transmitted light transmitted through the photoelectric conversion part to the photoelectric conversion part. The reflection part formation member has a bottom surface disposed adjacent to the front surface of the semiconductor substrate and a side on which the reflection part is formed.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3982411A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3982411A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3982411A13</originalsourceid><addsrcrecordid>eNrjZFDy9HV09_RzV3D1cfV19QtRcPRzUYCJubiGeTq78jCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSSeNcAY0sLIxNDQ0dDYyKUAADRDSGu</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>IMAGING ELEMENT AND IMAGING DEVICE</title><source>esp@cenet</source><creator>MASAGAKI Atsushi ; KUNITAKE Sachihito ; NOUDO Shinichiro</creator><creatorcontrib>MASAGAKI Atsushi ; KUNITAKE Sachihito ; NOUDO Shinichiro</creatorcontrib><description>Leakage of incident light to a charge holding part is reduced in a back surface irradiation type imaging element.The imaging element includes a photoelectric conversion part, a reflection part, and a reflection part formation member. The photoelectric conversion part is formed in a semiconductor substrate and performs photoelectric conversion of incident light. The reflection part is disposed in a front surface of the semiconductor substrate, which is different from a surface on which the incident light is incident, to reflect transmitted light transmitted through the photoelectric conversion part to the photoelectric conversion part. The reflection part formation member has a bottom surface disposed adjacent to the front surface of the semiconductor substrate and a side on which the reflection part is formed.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PICTORIAL COMMUNICATION, e.g. TELEVISION ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220413&amp;DB=EPODOC&amp;CC=EP&amp;NR=3982411A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220413&amp;DB=EPODOC&amp;CC=EP&amp;NR=3982411A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MASAGAKI Atsushi</creatorcontrib><creatorcontrib>KUNITAKE Sachihito</creatorcontrib><creatorcontrib>NOUDO Shinichiro</creatorcontrib><title>IMAGING ELEMENT AND IMAGING DEVICE</title><description>Leakage of incident light to a charge holding part is reduced in a back surface irradiation type imaging element.The imaging element includes a photoelectric conversion part, a reflection part, and a reflection part formation member. The photoelectric conversion part is formed in a semiconductor substrate and performs photoelectric conversion of incident light. The reflection part is disposed in a front surface of the semiconductor substrate, which is different from a surface on which the incident light is incident, to reflect transmitted light transmitted through the photoelectric conversion part to the photoelectric conversion part. The reflection part formation member has a bottom surface disposed adjacent to the front surface of the semiconductor substrate and a side on which the reflection part is formed.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PICTORIAL COMMUNICATION, e.g. TELEVISION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDy9HV09_RzV3D1cfV19QtRcPRzUYCJubiGeTq78jCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSSeNcAY0sLIxNDQ0dDYyKUAADRDSGu</recordid><startdate>20220413</startdate><enddate>20220413</enddate><creator>MASAGAKI Atsushi</creator><creator>KUNITAKE Sachihito</creator><creator>NOUDO Shinichiro</creator><scope>EVB</scope></search><sort><creationdate>20220413</creationdate><title>IMAGING ELEMENT AND IMAGING DEVICE</title><author>MASAGAKI Atsushi ; KUNITAKE Sachihito ; NOUDO Shinichiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3982411A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PICTORIAL COMMUNICATION, e.g. TELEVISION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MASAGAKI Atsushi</creatorcontrib><creatorcontrib>KUNITAKE Sachihito</creatorcontrib><creatorcontrib>NOUDO Shinichiro</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MASAGAKI Atsushi</au><au>KUNITAKE Sachihito</au><au>NOUDO Shinichiro</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>IMAGING ELEMENT AND IMAGING DEVICE</title><date>2022-04-13</date><risdate>2022</risdate><abstract>Leakage of incident light to a charge holding part is reduced in a back surface irradiation type imaging element.The imaging element includes a photoelectric conversion part, a reflection part, and a reflection part formation member. The photoelectric conversion part is formed in a semiconductor substrate and performs photoelectric conversion of incident light. The reflection part is disposed in a front surface of the semiconductor substrate, which is different from a surface on which the incident light is incident, to reflect transmitted light transmitted through the photoelectric conversion part to the photoelectric conversion part. The reflection part formation member has a bottom surface disposed adjacent to the front surface of the semiconductor substrate and a side on which the reflection part is formed.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
title IMAGING ELEMENT AND IMAGING DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-15T22%3A25%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MASAGAKI%20Atsushi&rft.date=2022-04-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3982411A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true