POWER AMPLIFIER MODULES WITH FLIP-CHIP AND NON-FLIP-CHIP POWER TRANSISTOR DIES

An amplifier module includes a module substrate and first and second power transistor dies. The first power transistor die is coupled to a mounting surface of the module substrate, and has first and second input/output (I/O) contact pads and a first ground contact pad, all of which are all exposed at a surface of the first power transistor die that faces toward the mounting surface of the module substrate. The second power transistor die also is coupled to the mounting surface, and has third and fourth I/O contact pads and a second ground contact pad. The third and fourth I/O contact pads are exposed at a surface of the second power transistor die that faces away from the mounting surface of the module substrate, and the second ground contact pad is exposed at a surface of the second power transistor die that faces toward the mounting surface.