MOLD COOLING STRUCTURE

A mold cooling structure according to the present disclosure includes a first refrigerant flow channel (13) through which a first refrigerant for cooling a mold (1) flows; and a second refrigerant flow channel (14) through which a second refrigerant for cooling the first refrigerant flowing through...

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Bibliographische Detailangaben
1. Verfasser:	TAKASAKA, Hironori
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A mold cooling structure according to the present disclosure includes a first refrigerant flow channel (13) through which a first refrigerant for cooling a mold (1) flows; and a second refrigerant flow channel (14) through which a second refrigerant for cooling the first refrigerant flowing through the first refrigerant flow channel (13) flows. Further, the second refrigerant flow channel (14) extends along the first refrigerant flow channel (13). Furthermore, mutual heat exchange between the first refrigerant and the second refrigerant is performable.