THERMALLY-CONDUCTIVE SILICONE COMPOSITION, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD THEREFOR

The present invention is a thermal conductive silicone composition containing, in specific amounts, each of (A) an organopolysiloxane containing two or more alkenyl groups bonded to a silicon atom in one molecule, (B) an organohydrogenpolysiloxane containing two or more hydrogen atoms bonded to a si...

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Bibliographische Detailangaben
1. Verfasser:	AKIBA Shota
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention is a thermal conductive silicone composition containing, in specific amounts, each of (A) an organopolysiloxane containing two or more alkenyl groups bonded to a silicon atom in one molecule, (B) an organohydrogenpolysiloxane containing two or more hydrogen atoms bonded to a silicon atom in one molecule, (C) a catalyst for hydrosilylation reaction, (D) a silver powder with a tapped density of 3.0 g/cm3 or higher, a specific surface area of 2.0 m2/g or less, and an aspect ratio of 1 to 30, and (E) a natural graphite powder or a synthetic graphite powder with an average particle size of 3 µm to 50 µm. This provides: a thermal conductive silicone composition that gives a cured material having a favorable heat-dissipating property; a semiconductor device using the cured material of the composition; and a method for manufacturing the same.