PACKAGING TECHNIQUE FOR INDUCTIVE CONDUCTIVITY SENSORS

This invention presents a new packaging technique that allows for the use of a wider range of isolating materials for inductive conductivity sensors, thereby significantly reducing the cost of producing the sensors, improving their precision and accuracy, and increasing their sensitivity.

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Bibliographische Detailangaben
1. Verfasser: REZANEZHAD GATABI, Javad
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:This invention presents a new packaging technique that allows for the use of a wider range of isolating materials for inductive conductivity sensors, thereby significantly reducing the cost of producing the sensors, improving their precision and accuracy, and increasing their sensitivity.