THERMAL INTERFACE MATERIALS

The teachings herein relate to new compositions for thermal interface materials that provide improved thermal conductivity without requiring filler materials that are expensive or abrasive. The improved thermal conductivity is achieved using a combination of increased filler loading, selection of a filler having abroad particle size distribution, and selection of filler that is non-abrasive. In order to achieve maximum thermal conductivity, the combination of the liquid matrix material and the filler preferably are chosen to avoid forming bonds between filler particles. Such bonds can also be avoided by including a surface modifier that modifies the surface of the filler particles.