METHOD OF CLEANING WAFER AND WAFER WITH REDUCED IMPURITIES

METHOD OF CLEANING WAFER AND WAFER WITH REDUCED IMPURITIES

A method of cleaning a wafer comprises: a scrubbing operation comprising treating a target wafer to be cleaned with a brush at a rotation rate of 200 rpm or less to prepare a brush cleaned wafer; and a cleaning operation comprising cleaning the brush cleaned wafer with a cleaning solution to prepare...

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Bibliographische Detailangaben
Hauptverfasser: JANG, Byung Kyu, KU, Kap Ryeol, CHOI, Jung Woo, PARK, Jong Hwi, YANG, Eun Su, YOO, Il Hwan, KIM, Jung-Gyu, KO, Sang Ki
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of cleaning a wafer comprises: a scrubbing operation comprising treating a target wafer to be cleaned with a brush at a rotation rate of 200 rpm or less to prepare a brush cleaned wafer; and a cleaning operation comprising cleaning the brush cleaned wafer with a cleaning solution to prepare a cleaned bare wafer, wherein the cleaning operation comprises a first cleaning operation and a second cleaning operation sequentially.