BASE PLATE AND SUBSTRATE ASSEMBLY
The invention provides a base plate configured to be attached to a semiconductor substrate,whereby the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and whereby a thickness of the base plate...
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| creator | VAN DER VOORT, Dennis Dominic DE VRIES, Gosse Charles |
| description | The invention provides a base plate configured to be attached to a semiconductor substrate,whereby the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and whereby a thickness of the base plate is in a range between 50% to 200% of a thickness of the semiconductor substrate. |
| format | Patent |
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fre ; ger</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220323&DB=EPODOC&CC=EP&NR=3971647A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220323&DB=EPODOC&CC=EP&NR=3971647A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>VAN DER VOORT, Dennis Dominic</creatorcontrib><creatorcontrib>DE VRIES, Gosse Charles</creatorcontrib><title>BASE PLATE AND SUBSTRATE ASSEMBLY</title><description>The invention provides a base plate configured to be attached to a semiconductor substrate,whereby the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and whereby a thickness of the base plate is in a range between 50% to 200% of a thickness of the semiconductor substrate.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB0cgx2VQjwcQxxVXD0c1EIDnUKDgkC84KDXX2dfCJ5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8a4CxpbmhmYm5o6ExEUoAx1Ihuw</recordid><startdate>20220323</startdate><enddate>20220323</enddate><creator>VAN DER VOORT, Dennis Dominic</creator><creator>DE VRIES, Gosse Charles</creator><scope>EVB</scope></search><sort><creationdate>20220323</creationdate><title>BASE PLATE AND SUBSTRATE ASSEMBLY</title><author>VAN DER VOORT, Dennis Dominic ; 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| language | eng ; fre ; ger |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
| title | BASE PLATE AND SUBSTRATE ASSEMBLY |
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