BASE PLATE AND SUBSTRATE ASSEMBLY

The invention provides a base plate configured to be attached to a semiconductor substrate,whereby the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and whereby a thickness of the base plate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	VAN DER VOORT, Dennis Dominic, DE VRIES, Gosse Charles
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention provides a base plate configured to be attached to a semiconductor substrate,whereby the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and whereby a thickness of the base plate is in a range between 50% to 200% of a thickness of the semiconductor substrate.