METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT INVOLVING PERFORMING AN ELECTROSTATIC DISCHARGE TEST

In a method of manufacturing an integrated circuit involving performing an electrostatic discharge, ESD, test, a weak frequency band is detected by sequentially radiating a plurality of first electromagnetic waves on a first test board (200) including the integrated circuit. First peak-to-peak voltage signals are detected by sequentially radiating the plurality of first electromagnetic waves on a second test board (201) including an electromagnetic wave receiving module (230). A frequency spectrum is detected by radiating a second electromagnetic wave on a housing (250) including a third test board (203) including the electromagnetic wave receiving module (230). A second peak-to-peak voltage signal is generated based on the weak frequency band, the first peak-to-peak voltage signals and the frequency spectrum. An ESD characteristic associated with an electronic system including the integrated circuit is predicted based on the second peak-to-peak voltage signal.