GROOVE PROCESSING DEVICE AND GROOVE PROCESSING METHOD

A groove processing device (100) that forms a groove in a surface of an object using a laser beam includes: a light source device (11) that outputs the laser beam; a polygon mirror (10) that reflects the laser beam output from the light source device (11); and an optical system that is provided on a...

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Bibliographische Detailangaben
1. Verfasser:	HAMAMURA Hideyuki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A groove processing device (100) that forms a groove in a surface of an object using a laser beam includes: a light source device (11) that outputs the laser beam; a polygon mirror (10) that reflects the laser beam output from the light source device (11); and an optical system that is provided on an optical path of the laser beam reflected from the polygon mirror (10) and includes a condensing portion (13A) which transmits the laser beam reflected from one surface of the polygon mirror (10) so as to be focused on the surface of the object and a non-condensing portion (13B) which is provided outside the condensing portion (13A) and transmits the laser beam reflected from a corner portion, in which two adjacent surfaces of the polygon mirror (10) meet, so as not to be focused on the surface of the object.