HEAT DISSIPATION APPARATUS, DEVICE, EQUIPMENT RACK, AND SYSTEM

This application provides a heat dissipation apparatus, a device, a rack, and a system. The heat dissipation apparatus mainly includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configure...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XIA, Gaoliang, GONG, Xinhu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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