HEAT DISSIPATION APPARATUS, DEVICE, EQUIPMENT RACK, AND SYSTEM

This application provides a heat dissipation apparatus, a device, a rack, and a system. The heat dissipation apparatus mainly includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base, and the first surface and the second surface are disposed opposite to each other; and a pressing plate, configured to fasten the heat-conducting plate in the accommodation cavity, where the pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, the sealing cavity is configured to accommodate the liquid channel, and a liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate. In the foregoing structure, the entire heat dissipation apparatus uses a modularized standard separated structure, and the pressing plate and the mounting base may be made into standard parts. When heat dissipation is performed on chips having different heat dissipation requirements, only a corresponding heat-conducting plate needs to be selected as required, and the mounting base and the pressing plate may still be used. This improves adaptability of the heat dissipation apparatus.