METHOD AND DEVICE FOR LASER PROCESSING A WORKPIECE

Methods, devices, apparatus, and systems are described for separating workpiece parts from workpieces using a focused machining beam. The methods include creating a trough in the workpiece using the focused machining beam, the trough being created along at least one section of a contour of the at le...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WEISS, Christoph, SEPP, Florian
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Methods, devices, apparatus, and systems are described for separating workpiece parts from workpieces using a focused machining beam. The methods include creating a trough in the workpiece using the focused machining beam, the trough being created along at least one section of a contour of the at least one workpiece part to be separated from the workpiece, altering a focal position of the machining beam such that the machining beam has a smaller beam diameter on the workpiece, and creating a gap in the workpiece using the machining beam with the altered focal position along at least one section of the contour of the at least one workpiece part to be separated from the workpiece. The gap is created at least partially within the trough.