MICROCHIP

Providing a microchip which is capable of being manufactured with simple equipment, and improving the bonding strength between the first substrate and the second substrate while forming the desired microstructure therein. A microchip includes: a first substrate 10; a second substrate 20 that is partially bonded to the first substrate, the second substrate having a main surface and an outer side face; a hollow channel 23 that is located between the first substrate and the second substrate, the channel 23 extending in a direction along the main surface of the second substrate; a liquid distribution port (21, 22) that is formed to penetrate the second substrate from the channel toward the main surface thereof located at an opposite side of the first substrate; a first bonding section 31 that bonds the first substrate to the second substrate to surround the channel when viewed from a direction orthogonal to the main surface; a second bonding section 32 located at a position closer to the outer side face 24 of the second substrate than the first bonding section, and that bonds the first substrate to the second substrate; and an internal space 25 provided between the first bonding section and the second bonding section, and that communicates with a space outside the first substrate and the second substrate.