POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE OBTAINED BY MOLDING SAME

A polyamide resin composition including a semi-aromatic polyamide (A) having a melting point of 290 to 330°C and a fibrous reinforcing material (B), wherein the polyamide resin composition has an amount of creep strain of 2.0% or less in the flow direction after a lapse of 100 hours under the measur...

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Bibliographische Detailangaben
Hauptverfasser: ASAI Miho, MII Junichi
Format: Patent
Sprache:eng ; fre ; ger
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