POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE OBTAINED BY MOLDING SAME
A polyamide resin composition including a semi-aromatic polyamide (A) having a melting point of 290 to 330°C and a fibrous reinforcing material (B), wherein the polyamide resin composition has an amount of creep strain of 2.0% or less in the flow direction after a lapse of 100 hours under the measur...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | A polyamide resin composition including a semi-aromatic polyamide (A) having a melting point of 290 to 330°C and a fibrous reinforcing material (B), wherein the polyamide resin composition has an amount of creep strain of 2.0% or less in the flow direction after a lapse of 100 hours under the measurement conditions of a temperature of 100°C and a tensile load of 75 MPa. |
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