POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE OBTAINED BY MOLDING SAME

A polyamide resin composition including a semi-aromatic polyamide (A) having a melting point of 290 to 330°C and a fibrous reinforcing material (B), wherein the polyamide resin composition has an amount of creep strain of 2.0% or less in the flow direction after a lapse of 100 hours under the measur...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ASAI Miho, MII Junichi
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A polyamide resin composition including a semi-aromatic polyamide (A) having a melting point of 290 to 330°C and a fibrous reinforcing material (B), wherein the polyamide resin composition has an amount of creep strain of 2.0% or less in the flow direction after a lapse of 100 hours under the measurement conditions of a temperature of 100°C and a tensile load of 75 MPa.