SOUND-ABSORBING MATERIAL

The present disclosure relates to a sound-absorbing material including a resin film; a first substrate layer having communication holes; and a second substrate layer having communication holes, in this order.

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Bibliographische Detailangaben
Hauptverfasser:	YOKOKURA, Ai, TAKAYASU, Satoshi, KOTAKE, Tomohiko
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ACOUSTICS ACOUSTICS NOT OTHERWISE PROVIDED FOR BUILDING CEILINGS FIXED CONSTRUCTIONS FLOORS GENERAL BUILDING CONSTRUCTIONS INSULATION OR OTHER PROTECTION OF BUILDINGS METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING,NOISE OR OTHER ACOUSTIC WAVES IN GENERAL MUSICAL INSTRUMENTS PHYSICS ROOFS SOUND-PRODUCING DEVICES WALLS, e.g. PARTITIONS
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Beschreibung
Zusammenfassung:	The present disclosure relates to a sound-absorbing material including a resin film; a first substrate layer having communication holes; and a second substrate layer having communication holes, in this order.