HEAT-CONDUCTIVE COMPOSITION, HEAT-CONDUCTIVE MEMBER, AND BATTERY MODULE

Provided is a thermally conductive member that has excellent adhesion and does not easily peel off from an adherend even when vibration or the like is repeatedly applied.A thermally conductive composition containing a curable organopolysiloxane (A), an alkoxysilane compound (B), and a thermally cond...

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Bibliographische Detailangaben
Hauptverfasser:	UMETANI, Hiroshi, ISHIDA, Keita
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Provided is a thermally conductive member that has excellent adhesion and does not easily peel off from an adherend even when vibration or the like is repeatedly applied.A thermally conductive composition containing a curable organopolysiloxane (A), an alkoxysilane compound (B), and a thermally conductive filler (C), in which the alkoxysilane compound (B) is an alkoxysilane containing long-chain alkenyl group.