HOUSING, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING HOUSING, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

A housing according to the embodiment includes a lower surface part, an upper surface part, and a side surface part. The lower surface part includes a contact surface contacting an adherend. The upper surface part is separated in a vertical direction from the lower surface part with a first space in...

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Bibliographische Detailangaben
Hauptverfasser:	KOMATSU, Izuru, ASAGIRI, Satoru
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DIAGNOSIS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HUMAN NECESSITIES HYGIENE IDENTIFICATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR MEDICAL OR VETERINARY SCIENCE PHYSICS PRINTED CIRCUITS SURGERY TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	A housing according to the embodiment includes a lower surface part, an upper surface part, and a side surface part. The lower surface part includes a contact surface contacting an adherend. The upper surface part is separated in a vertical direction from the lower surface part with a first space interposed. The side surface part is provided around the first space and is connected to the upper surface part and the lower surface part. The upper surface part and the side surface part include a first material. The lower surface part includes a second material that is softer than the first material. A portion that includes the second material is exposed for at least a portion of the contact surface.